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Samsung Electronics estimates $100 million or more revenues from innovative chip packaging industry

A member of the event crew stands during the Samsung Electronics Co. annual general meeting at the Suwon Convention Center in Suwon, South Korea, on Wednesday, March 20, 2024

SEOUL, March 20 (mod1s) - Samsung Electronics (005930.KS), opens new tab anticipates $100 million or more in sales from its next batch of sophisticated chip-packaging products this year, co-CEO Kye-Hyun Kyung said on Wednesday. 

Samsung established up advanced chip packaging as a business unit last year, and Kyung said he expects the effects of Samsung's investment to come out in earnest from the second half of this year. 

Kyung's statements were delivered during Samsung's annual general shareholders' meeting.

Samsung's memory chip unit intends to attain a bigger profit share than its market share this year, Kyung added. 

Samsung's market share in DRAM chips, used in electronic products, reached 45.5% in the fourth quarter last year, according to data source TrendForce. 

To achieve this, Samsung hopes to establish a competitive edge in high-end memory chips needed by increasing artificial intelligence demand, including mass manufacturing a 12-stack version of high-bandwidth memory (HBM) chips dubbed HBM3E.

For a future generation of HBM chips termed HBM4, scheduled to be delivered in 2025 with more customisable designs, Samsung will take advantage of having memory chips, chip contract manufacturing and chip design firms under one roof to suit client demands, Kyung added. 

Answering a shareholder query on Samsung's recent setback in the present HBM market compared to competitor SK Hynix (000660.KS), opens new tab, Kyung said: "We're better prepared to prevent that from happening again in the future".

Samsung Electronics shares jumped as much as 6.04% on Wednesday, and are headed for their greatest one-day rise since early September following Nvidia (NVDA.O), opens new tab CEO Jensen Huang said the AI semiconductor leader is validating Samsung's HBM chips for usage. 

Samsung anticipates meaningful results shortly from additional memory products being developed for use in AI, including compute express link (CXL) and processing-in-memory (PIM) devices, Kyung noted.


Source: https://www.reuters.com/

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